Sub 5 Å-EOT HfₓZr1–xO₂ for Next-Generation DRAM Capacitors Using Morphotropic Phase Boundary and High-Pressure (200 atm) Annealing With Rapid Cooling Process
- Journal
- IEEE Transactions on Electron Devices
- Vol
- 69
- Page
- 103-108
- Year
- 2021
- Link
- https://ieeexplore.ieee.org/abstract/document/9656544 1502회 연결
